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EPOXY KIT 1050-1053S/1056S/1059S

Structural epoxy lamination system RESOLTECH 1050 / 105xS is a B-stage-free, fluid epoxy lamination system for small parts and large composite structures with all existing reinforcements. Build your kit with the packaging and hardener of your choice! (1053S, 1056S or 1059S)

 44,39 209,17 HT

Description

Structural epoxy lamination system

RESOLTECH 1050 / 105xS is a B-stage-free, fluid epoxy lamination system for small parts and large composite structures with all existing reinforcements.

RESOLTECH 1050 / 105xS is a formulation that does not crystallize, contains no CMR components and meets the new requirements of the European REACH regulation.

Thanks to its adapted viscosity and wide range of reactivities, the 1050/105xS system can be used for traditional wet process, vacuum and filament winding applications. A thixotropic 1050T version is available for certain applications, such as vertical laminates.

All 105xS hardeners in this system are dosed at 35 parts per 100 parts of 1050 resin by weight. They are compatible with each other and can be mixed to obtain a reactivity tailored to the application.

After curing at room temperature, the 1050 / 105xS system can be demolded without post-curing. To accelerate demolding after hardening, we recommend post-curing at 40°C. To obtain optimum thermomechanical properties, post-firing up to 60°C is required.

The greatest quality of the RESOLTECH 1050 / 105XS system is its exceptional wettability, enabling it to impregnate fibers such as carbon and aramid. Thanks to its excellent cohesion with the fiber, the 1050 / 105xS system is ideal for parts subject to fatigue stress.

Its formulation enables the user to produce structural parts without post-firing.

Product benefits

– Adjustable working time from 10min to 14h

– Excellent wetting properties with all types of reinforcement

– Wide choice of reactivity with 6 hardeners

– Production from small parts to large composite structures

– No B stage after curing at room temperature

Information

TG (°C) 75

Mixture density 1.1

Mixing viscosity (mPa.s) 251 – 637

Potlife at 23°C: 1053S (14h) – 1056S (37min.) – 1059S (10min.)

Technical data https://www.resoltech.com/fr/produits/epoxy/1050-detail.html